APPLICATION
The RPP171/RPP173 Mini-ITX systems are designed to deliver high-performance computing with 13th Gen Intel® Core™ processors, supporting up to 28W TDP. These compact systems offer dual DDR5 SODIMM slots with support for up to 64GB of memory at 5200MHz, ensuring smooth multitasking and application performance.
With rich connectivity, the systems feature up to three 2.5GbE LAN ports, quad-display support via DP, HDMI, USB Type-C, and optional M2A-Display, along with multiple USB 3.2 Gen2 and USB 2.0 ports. Expansion capabilities include PCIe Gen 4 x4, M.2 slots for NVMe storage, Wi-Fi, and additional display options, as well as support for nano SIM cards.
The RPP171 operates on a 12V DC input, while the RPP173 supports a wide voltage range of 9–36V, making it versatile for industrial and embedded applications. With robust design features like TPM 2.0 for security and compatibility with Windows and Linux operating systems, these systems are ideal for IoT, industrial automation, and edge computing environments.
feature list
Supports 13th Gen Intel® Core™ processors with up to 28W TDP
Dual DDR5 SODIMM slots supporting up to 64GB at 5200MHz
Quad-display support via DP, HDMI, USB Type-C, and optional M2A-Display
Up to three 2.5GbE LAN ports
Rich I/O with four USB 3.2 Gen2, one USB Type-C, and four USB 2.0 ports
Expansion options with PCIe Gen 4 x4, M.2 M, B, E, and A key slots
Wide power input: 12V DC for RPP171, 9–36V DC for RPP173
Compact Mini-ITX form factor with robust fanless and active cooling options
Advanced security with TPM 2.0 support
Compatible with Windows IoT, Windows 11, and Linux operating systems
| MODEL NUMBER | CPU | MEMORY | PORTS | OPERATING TEMP |
|---|---|---|---|---|
| RPP171-IE-1365UE | 13th Generation Intel® Core™ | 2 DDR5 | Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack | -20 to 70°C |
| RPP171-IE-1345UE | 13th Generation Intel® Core™ | 2 DDR5 | Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack | -20 to 70°C |
| RPP171-IB-1315UE | 13th Generation Intel® Core™ | 2 DDR5 | Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack | -5 to 65°C |
| RPP171-IB-U300E | 13th Generation Intel® Core™ | 2 DDR5 | Rear I/O( 2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack | -5 to 65°C |
| RPP173-IE-1365UE | 13th Generation Intel® Core™ | 2 DDR5 | Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack | -20 to 70°C |
| RPP173-IE-1345UE | 13th Generation Intel® Core™ | 2 DDR5 | Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack | -20 to 70°C |
| RPP173-IB-1315UE | 13th Generation Intel® Core™ | 2 DDR5 | Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack | -5 to 65°C |
| RPP173-IB-U300E | 13th Generation Intel® Core™ | 2 DDR5 | Rear I/O(2 DP/HDMI combo, 3 LAN, 4 USB 3.2 Gen2, 1 USB Type C), Internal I/O (M.2 M/B/E/A Key, 4 USB 2.0, w/TPM), DC-Jack | -5 to 65°C |
LET’S MAKE THIS EASY. CALL 01929 555 700
why choose relec?
-
Faster
Our aim is to get back to you with an initial response within the hour.
-
Attention to detail
We pride ourselves on getting you the right product, at the right price and on time.
-
New ideas
We are constantly looking for latest technology and products for your applications.
-
Beyond standard
It’s not just about the product. Our service goes way beyond the norm.
-
Easy
We want to make your life as simple as it can be. Call us to find out what we can offer.
sign up for our newsletter
Enter your email address below