M8MP553

Processor: ARM® i.Mx8M plus-based
Memory: Up to 16GB
Form Factor: 3.5″ Single Board Computer
Supports: HDMI & LVDs
Size: 146 x 102 x 20.6mm
Operating Temperature -30°C to +80°C

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01929 555 700
sales@relec.co.uk

APPLICATION

The M8MP553 is a 3.5-inch SBC powered by the NXP i.MX 8M Plus processor, designed for industrial and embedded applications requiring high reliability and versatile performance. With up to 8GB of LPDDR4 memory, dual-display support, and rich I/O capabilities, this board is ideal for AI-driven edge computing, IoT, and multimedia applications. Its wide operating temperature range and robust power support make it suitable for challenging environments.

feature list

Quad-core 1.6GHz with integrated VPU, ISP, and CAN FD
Supports up to 8GB LPDDR4 at 4000MT/s
HDMI (1920x1080 @60Hz) and LVDS (1920x1200 @60Hz)
Dual GbE LAN, USB 3.1 Gen1, USB 2.0, RS232, RS485, and CANbus
Built-in eMMC 5.1 (16GB default, up to 64GB) with uSD card support
Includes M.2 B Key (3052/2242), M.2 E Key (2230), and Nano SIM slot
Operates on 9–36VDC input, with configurations
Integrated Neural Processing Unit (NPU)
Supports operating temperatures from -30°C to 80°C, with fanless operation
Runs Linux Yocto 3.0 and Android 10

MODEL NUMBER	CPU	MEMORY	OPERATING TEMPERATURE	PORTS
M8MP553-ECC-41QDI	Quad Core Processor	4GB	-30°C ~ 80°C	2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0
M8MP553-ECC-21DLI	Dual Core Processor	2GB	-30°C ~ 80°C	2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0
M8MP553-ECC-81QDI	Quad Core Processor	8GB	-30°C ~ 80°C	2 GbE, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 4 USB 2.0

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